Updated git submodules

Project: integration master 16921f6aff04255cbc049142757fe49ba4f8667e

Merge "Bump demo artifact and script versions"

Bump demo artifact and script versions

Change-Id: I02c9fc3859ab3f4ffd61c20420e09d66fd030593
Issue-ID: INT-586
Signed-off-by: Gary Wu <gary.i.wu@huawei.com>


1 file changed