Updated git submodules

Project: integration master 7f6f476b19ba08ffb6ce11ed14e900e6a1a77a43

Merge "Version bump testsuite release image"

Version bump testsuite release image

Change-Id: I234f275b6e081745dcd2062ad5d46d7b482c1f1b
Issue-ID: INT-723
Signed-off-by: Gary Wu <gary.i.wu@huawei.com>


1 file changed